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... Spacing between the drills is just right. You hand the data set to the fabricator, and voila! No unexpected phone calls, no changes in | CIRCUIT BOARDS | the layout, and the fabricator happily sends back a good set of boards on time. Our recommendations for the correct storage of | PCBS AND | CIRCUIT BOARDS | MLBS | A.1 ) Brief desricption of the problem: PCB`s, especially Multilayer boards are extremly sensitive towards moisture The microscopic structure of the Multilayer material | CIRCUIT BOARDS | develops a strong capillary power that soaks up the humidity of the surrounding air. Even under very dry conditions it is a question of time | CIRCUIT BOARDS | that water accumulates in the stored PCB`s. For example: At storage conditions of 20 C° and 35 % of humidity the weight of the epoxyraisin | CIRCUIT BOARDS | of the Multilayer PCB`s rises 0,12 % due to the accumulation of moisture. If the capillary effect leads to an increase of more than 0,17 | CIRCUIT BOARDS | % a gas pressure of 8-10 bar can be reached, causing delamination Even if delamination tests are made after production, the ...
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... overwhelming rise in demand for high-density interconnect structures (HDIS). The demand for HDIS translates directly into a vigorous market for the microvias used in | CIRCUIT BOARDS | many of these multilayer substrates as well as in conventional PCBs. In 1998, for example, the worldwide microvia market made up about four percent of | CIRCUIT BOARDS | the total multilayer PCB market. By 2007 that market share is expected to expand to nearly 30 percent Worldwide, | THE TOTAL MICROVIA MARKET | | CIRCUIT BOARDS | approached $4 billion in 2000 - up 63 percent over 1999 (Figure 2).1 By the end of 2001 the market should reach $5.6 billion - | CIRCUIT BOARDS | up another 50 percent over 2000. These same data show Japan as the microvia leader, followed by Europe, Asia, and North America. Several factors contribute | CIRCUIT BOARDS | to this remarkable expansion, the most important being the steadily increasing interconnect density of PCBs. Microvias have become an attractive interconnect alternative when the wiring | CIRCUIT BOARDS | density on a PCB approaches 160 I/Os per sq. in.2 Viewed another ...
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... implementation of lead-free regulations (ROHS), the greater the attempts to achieve lead-free solutions that are comparable to the “all-purpose answer” SnPb in terms of | CIRCUIT BOARDS | technology and cost. Two systems are particularly predominant: tin/silver/copper (SnAgCu) and, more recently, stabilised tin/copper (SnCuNi). Although the level of efficiency of both systems is | CIRCUIT BOARDS | not yet completely clear, the following presents the latest information: SnAgCu There is more experience in the field of silver systems. Here, differentiation is made | CIRCUIT BOARDS | between the Sn-3.5Ag-0.7Cu, Sn-4Ag-0.5Cu and Sn-3Ag- 0.5Cu systems which vary in use from continent to continent. However, the agreed expert opinion (IPC/Soldertech-Conference Brussels 2003) is | CIRCUIT BOARDS | that the technological differences between the three systems are negligible. Sn-3.5Ag- 0.7Cu is the most common alloy in Europe. SnCuNi Although there are even fewer | CIRCUIT BOARDS | field results for the stabilised tin/copper system Sn-0.7Cu-0.1Ni, it shows a lot of potential. It ...
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